Semiconductor device structure with bottle-shaped through silicon via and method for forming the same

ABSTRACT

A semiconductor device structure includes a silicon layer disposed over a first semiconductor die, and a first mask layer disposed over the silicon layer. The semiconductor device structure also includes a second semiconductor die disposed over the first mask layer, and a through silicon via penetrating through the silicon layer and the first mask layer. A bottom surface of the through silicon via is greater than a top surface of the through silicon via, and the top surface of the through silicon via is greater than a cross-section of the through silicon via between and parallel to the top surface and the bottom surface of the through silicon via.

TECHNICAL FIELD

The present disclosure relates to a semiconductor device structure and amethod for forming the same, and more particularly, to a semiconductordevice structure with a bottle-shaped through-silicon via and a methodfor forming the same.

DISCUSSION OF THE BACKGROUND

Semiconductor devices are essential for many modern applications. Withthe advancement of electronic technology, semiconductor devices arebecoming smaller in size while providing greater functionality andincluding greater amounts of integrated circuitry. Due to theminiaturized scale of semiconductor devices, various types anddimensions of semiconductor devices providing different functionalitiesare integrated and packaged into a single module. Furthermore, numerousmanufacturing operations are implemented for integration of varioustypes of semiconductor devices.

However, the manufacturing and integration of semiconductor devicesinvolve many complicated steps and operations. Integration insemiconductor devices becomes increasingly complicated. An increase incomplexity of manufacturing and integration of the semiconductor devicemay cause deficiencies. Accordingly, there is a continuous need toimprove the structure and the manufacturing process of semiconductordevices so that the deficiencies can be addressed, and the performancecan be enhanced.

This Discussion of the Background section is provided for backgroundinformation only. The statements in this Discussion of the Backgroundare not an admission that the subject matter disclosed in this sectionconstitutes prior art to the present disclosure, and no part of thisDiscussion of the Background section may be used as an admission thatany part of this application, including this Discussion of theBackground section, constitutes prior art to the present disclosure.

SUMMARY

In one embodiment of the present disclosure, a semiconductor devicestructure is provided. The semiconductor device structure includes asilicon layer disposed over a first semiconductor die, and a first masklayer disposed over the silicon layer. The semiconductor devicestructure also includes a second semiconductor die disposed over thefirst mask layer, and a through silicon via penetrating through thesilicon layer and the first mask layer. A bottom surface of the throughsilicon via is greater than a top surface of the through silicon via,and the top surface of the through silicon via is greater than across-section of the through silicon via between and parallel to the topsurface and the bottom surface of the through silicon via.

In an embodiment, the through silicon via is in direct contact with afirst conductive pad in the first semiconductor die and a secondconductive pad in the second semiconductor die. In an embodiment, thesemiconductor device structure further includes a third conductive paddisposed in the first semiconductor die and adjacent to the firstconductive pad, and a fourth conductive pad disposed in the secondsemiconductor die and adjacent to the second conductive pad, wherein alateral distance between the third conductive pad and the firstconductive pad in the first semiconductor die is greater than a lateraldistance between the fourth conductive pad and the second conductive padin the second semiconductor die. In an embodiment, the semiconductordevice structure further includes a second mask layer disposed betweenthe first mask layer and the second semiconductor die, wherein thethrough silicon via penetrates through the second mask layer, andwherein the first mask layer and the second mask layer are made ofdifferent materials.

In an embodiment, a sidewall of the second mask layer is inclinedrelative to a sidewall of the first mask layer. In an embodiment, thesemiconductor device structure further includes a protective layercovering the sidewall of the second mask layer, the sidewall of thefirst mask layer and an upper sidewall of the silicon layer, wherein theupper sidewall of the silicon layer is substantially aligned with thesidewall of the first mask layer. In an embodiment, the through siliconvia further includes a conductive layer, a barrier layer coveringsidewalls and a bottom surface of the conductive layer, wherein thebarrier layer is in direct contact with the first semiconductor die. Inaddition, the through silicon via includes a lining layer coveringsidewalls of the barrier layer.

In another embodiment of the present disclosure, a semiconductor devicestructure is provided. The semiconductor device structure includes asilicon layer disposed over a first semiconductor die, and a first masklayer disposed over the silicon layer. The semiconductor devicestructure also includes a second mask layer disposed over the first masklayer, and a second semiconductor die disposed over the second masklayer. The semiconductor device structure further includes a throughsilicon via penetrating through the silicon layer, the first mask layerand the second mask layer to electrically connect the firstsemiconductor die and the second semiconductor die. The through siliconvia has a bottle-neck shaped portion surrounded by the first mask layerand an upper portion of the silicon layer, and an interface area betweenthe through silicon via and the first semiconductor die is greater thanan interface area between the through silicon via and the secondsemiconductor die.

In an embodiment, the first semiconductor die has a first criticaldimension, and the second semiconductor die has a second criticaldimension, and the first critical dimension is greater than the secondcritical dimension. In an embodiment, the through silicon via furtherincludes a top portion surrounded by the second mask layer, and a bottomportion surrounded by a lower portion of the silicon layer, wherein thebottle-neck shaped portion of the through silicon via is sandwichedbetween the top portion and the bottom portion of the through siliconvia, and the top portion of the through silicon via has a taperedprofile tapering toward the bottle-neck shaped portion of the throughsilicon via.

In an embodiment, the bottom portion of the through silicon via hasrounded and convex top corners. In an embodiment, the bottle-neck shapedportion and the top portion of the through silicon via are separatedfrom the first mask layer, the second mask layer and the upper portionof the silicon layer by a protective layer. In an embodiment, the bottomportion of the through silicon via is in direct contact with the lowerportion of the silicon layer. In an embodiment, the protective layerincludes aluminum oxide.

In yet another embodiment of the present disclosure, a method forforming a semiconductor device structure is provided. The methodincludes forming a silicon layer over a first semiconductor die, andforming a first mask layer over the silicon layer. The method alsoincludes forming a first opening penetrating through the first masklayer and forming a second opening penetrating through the siliconlayer, and depositing a protective layer over the first mask layer. Theprotective layer extends to cover a sidewall of the first mask layer andan upper sidewall of the silicon layer. The method further includesetching the silicon layer by using the protective layer as a mask toundercut an upper portion of the silicon layer such that an enlargedsecond opening is formed. In addition, the method includes filling thefirst opening and the enlarged second opening with a through siliconvia, and forming a second semiconductor die over the through siliconvia.

In an embodiment, the method further includes forming a second masklayer over the first mask layer, and forming a third opening penetratingthrough the second mask layer before the first opening penetratingthrough the first mask layer is formed. In an embodiment, the secondmask layer is etched to form an enlarged third opening during theforming the second opening penetrating through the silicon layer, andthe enlarged third opening has a tapered profile tapering toward thefirst opening.

In an embodiment, the protective layer is formed by a non-conformaldeposition process. In an embodiment, the method further includesremoving the protective layer before the through silicon via is formed.In an embodiment, the upper portion of the silicon layer covers a bottomportion of the through silicon via.

Embodiments of a semiconductor device structure and method for formingthe same are provided in the disclosure. In some embodiments, thesemiconductor device structure includes a through silicon via. Thebottom surface of the through silicon via is greater than the topsurface of the through silicon via, and the top surface of the throughsilicon via is greater than a cross-section of the through silicon viabetween and parallel to the top surface and the bottom surface of thethrough silicon via. Therefore, the through silicon via can be used toelectrically connect two semiconductor dies (or semiconductor wafers)with different design rules (e.g., different pattern densities ordifferent critical dimensions) in the vertical direction. As a result,functional density (i.e., the number of interconnected devices per chiparea) may be increased, providing benefits such as increased productionefficiency, lowered costs, and improved performance.

The foregoing has outlined rather broadly the features and technicaladvantages of the present disclosure in order that the detaileddescription of the disclosure that follows may be better understood.Additional features and advantages of the disclosure will be describedhereinafter, and form the subject of the claims of the disclosure. Itshould be appreciated by those skilled in the art that the conceptionand specific embodiment disclosed may be readily utilized as a basis formodifying or designing other structures or processes for carrying outthe same purposes of the present disclosure. It should also be realizedby those skilled in the art that such equivalent constructions do notdepart from the spirit and scope of the disclosure as set forth in theappended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a cross-sectional view illustrating a semiconductor devicestructure, in accordance with some embodiments.

FIG. 2 is a partial enlarged view of FIG. 1, in accordance with someembodiments.

FIG. 3 is a cross-sectional view illustrating a modified semiconductordevice structure, in accordance with some embodiments.

FIG. 4 is a partial enlarged view of FIG. 3, in accordance with someembodiments.

FIG. 5 is a flow diagram illustrating a method for forming asemiconductor device structure, in accordance with some embodiments.

FIG. 6 is a cross-sectional view illustrating an intermediate stage offorming a silicon layer over a first semiconductor die during theformation of the semiconductor device structure, in accordance with someembodiments.

FIG. 7 is a cross-sectional view illustrating an intermediate stage ofsequentially forming a first mask layer and a second mask layer over thesilicon layer during the formation of the semiconductor devicestructure, in accordance with some embodiments.

FIG. 8 is a cross-sectional view illustrating an intermediate stage offorming an opening in the second mask layer during the formation of thesemiconductor device structure, in accordance with some embodiments.

FIG. 9 is a cross-sectional view illustrating an intermediate stage offorming an opening in the first mask layer during the formation of thesemiconductor device structure, in accordance with some embodiments.

FIG. 10 is a cross-sectional view illustrating an intermediate stage offorming an opening in the silicon layer during the formation of thesemiconductor device structure, in accordance with some embodiments.

FIG. 11 is a cross-sectional view illustrating an intermediate stage ofdepositing a protective layer during the formation of the semiconductordevice structure, in accordance with some embodiments.

FIG. 12 is a cross-sectional view illustrating an intermediate stage ofetching the silicon layer by using the protective layer as a mask duringthe formation of the semiconductor device structure, in accordance withsome embodiments.

FIG. 13 is a cross-sectional view illustrating an intermediate stage ofremoving the protective layer during the formation of the semiconductordevice structure, in accordance with some embodiments.

FIG. 14 is a cross-sectional view illustrating an intermediate stage offorming a lining material in the openings of the first mask layer, thesecond mask layer and the silicon layer during the formation of thesemiconductor device structure, in accordance with some embodiments.

FIG. 15 is a cross-sectional view illustrating an intermediate stage ofetching the lining material to form a lining layer during the formationof the semiconductor device structure, in accordance with someembodiments.

FIG. 16 is a cross-sectional view illustrating an intermediate stage offorming a barrier material over the lining layer during the formation ofthe semiconductor device structure, in accordance with some embodiments.

FIG. 17 is a cross-sectional view illustrating an intermediate stage offorming a conductive material over the barrier material during theformation of the semiconductor device structure, in accordance with someembodiments.

FIG. 18 is a cross-sectional view illustrating an intermediate stage ofplanarizing the conductive material and the barrier material to form athrough silicon via during the formation of the semiconductor devicestructure, in accordance with some embodiments.

FIG. 19 is a cross-sectional view illustrating an intermediate stage offorming a lining material over the protective layer during the formationof the modified semiconductor device structure, in accordance with someembodiments.

FIG. 20 is a cross-sectional view illustrating an intermediate stage ofetching the lining material to form a lining layer during the formationof the modified semiconductor device structure, in accordance with someembodiments.

FIG. 21 is a cross-sectional view illustrating an intermediate stage offorming a barrier material over the lining layer during the formation ofthe modified semiconductor device structure, in accordance with someembodiments.

FIG. 22 is a cross-sectional view illustrating an intermediate stage offorming a conductive material over the barrier material during theformation of the modified semiconductor device structure, in accordancewith some embodiments.

FIG. 23 is a cross-sectional view illustrating an intermediate stage ofplanarizing the conductive material and the barrier material to form athrough silicon via during the formation of the modified semiconductordevice structure, in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

FIG. 1 is a cross-sectional view illustrating a semiconductor devicestructure 100, in accordance with some embodiments. As shown in FIG. 1,the semiconductor device structure 100 includes a first semiconductordie 110, a silicon layer 111 disposed over the first semiconductor die110, a first mask layer 113 disposed over the silicon layer 111, asecond mask layer 115 disposed over the first mask layer 113, and asecond semiconductor die 180 disposed over the second mask layer 115.

In some embodiments, the first semiconductor die 110 includes asemiconductor substrate 101, a dielectric layer 103 disposed over thesemiconductor substrate 101, and a plurality of conductive pads 105 a,105 b and 105 c disposed in the dielectric layer 103. In someembodiments, the conductive pads 105 a, 105 b and 105 c are arranged toface the silicon layer 111. Similar to the first semiconductor die 110,the second semiconductor die 180 includes a semiconductor substrate 171,a dielectric layer 173, and a plurality of conductive pads 175 a, 175 b,175 c, 175 d and 175 e disposed in the dielectric layer 173. In someembodiments, the conductive pads 175 a, 175 b, 175 c, 175 d and 175 eare arranged to face the second mask layer 115.

Still referring to FIG. 1, the semiconductor device structure 100 alsoincludes a through silicon via 169 penetrating through the silicon layer111, the first mask layer 113 and the second mask layer 115, inaccordance with some embodiments. In some embodiments, the throughsilicon via 169 electrically connects the conductive pad 105 c in thefirst semiconductor die 110 and the conductive pad 175 d in the secondsemiconductor die 180. In some embodiments, the through silicon via 169is disposed in a keep-out zone, which is used to define a region whereno active device is placed within.

Specifically, the through silicon via 169 includes a conductive layer167′, a barrier layer 165′ surrounding the conductive layer 167′, and alining layer 163′ surrounding the barrier layer 165′. In someembodiments, the barrier layer 165′ covers the bottom surface and thesidewalls of the conductive layer 167′, and the lining layer 163′ coversthe sidewalls of the barrier layer 165′. In some embodiments, thebarrier layer 165′ and the lining layer 163′ are in direct contact withthe conductive pad 105 c, and the conductive layer 167′ is separatedfrom the conductive pad 105 c by the barrier layer 165′.

Moreover, the through silicon via 169 has a bottle-shaped profile, asshown in FIG. 1 in accordance with some embodiments. In addition, thesidewalls SW2 of the second mask layer 115 are inclined relative to thesidewalls SW1 of the first mask layer 113, and the sidewalls SW1 of thefirst mask layer 113 are substantially aligned with the upper sidewallsUSW of the silicon layer 111, in accordance with some embodiments.Within the context of this disclosure, the word “substantially” meanspreferably at least 90%, more preferably 95%, even more preferably 98%,and most preferably 99%.

Furthermore, the critical dimension of the first semiconductor die 110is greater than the critical dimension of the second semiconductor die180, in accordance with some embodiments. In some embodiments, thepattern density of the second semiconductor die 180 is greater than thepattern density of the first semiconductor die 110. In some embodiments,the conductive pad 105 c directly contacting the through silicon via 169has a width W1, the conductive pad 175 d directly contacting the throughsilicon via 169 has a width W2, and the width W1 is greater than thewidth W2. In some embodiments, a lateral distance between two adjacentconductive pads 105 in the first semiconductor die 110 is greater than alateral distance between two adjacent conductive pads 175 in the secondsemiconductor die 180. For example, the lateral distance D1 is greaterthan the lateral distance D2. Since the through silicon via 169 has abottle-shaped profile, the through silicon via 169 can be used toelectrically connect the first semiconductor die 110 and the secondsemiconductor die 180 with different design rules (e.g., differentpattern densities or different critical dimensions). For example, theconductive pad 105 c with greater width W1 contacts a wider bottomportion of the through silicon via 169, and the conductive pad 175 dwith smaller width W2 contacts a bottom portion of the through siliconvia 169.

FIG. 2 is a partial enlarged view of FIG. 1, in accordance with someembodiments. FIG. 2 illustrates the through silicon via 169 and itssurroundings. In some embodiments, the through silicon via 169 includesa top portion 169 a, a bottom portion 169 c, and a bottle-neck shapedportion 169 b sandwiched between the top portion 169 a and the bottomportion 169 c. The boundary of the top portion 169 a and the bottle-neckshaped portion 169 b is indicated by the dotted line I-I′, and theboundary of the bottle-neck shaped portion 169 b and the bottom portion169 c is indicated by the dotted line II-II′. As mentioned above, thethrough silicon via 169 has a bottom width W3 (i.e., the bottommostwidth of the bottom portion 169 c) and a top width W4 (i.e., the topmostwidth of the top portion 169 a), the bottom width W3 is greater than thetop width W4, in accordance with some embodiments. Referring to FIGS. 1and 2, the bottom portion 169 c of the through silicon via 169 contactsthe conductive pad 105 c having the greater width W1, and the topportion 169 a of the through silicon via 169 contacts the conductive pad175 d having the smaller width W2. Therefore, the through silicon via169 can be used to electrically connect the first semiconductor die 110and the second semiconductor die 180, which have different design rules.

In some embodiments, the top portion 169 a of the through silicon via169 is surrounded by the second mask layer 115, and the top portion 169a of the through silicon via 169 has a tapered profile tapering towardthe bottle-neck shaped portion 169 b of the through silicon via 169. Inother words, the widths of the top portion 169 a of the through siliconvia 169 gradually increase along a direction from bottom to top. In someembodiments, the bottle-neck shaped portion 169 b of the through siliconvia 169 is surrounded by the first mask layer 113 and an upper portion111U of the silicon layer 111, and the widths of the bottle-neck shapedportion 169 b of the through silicon via 169 are substantially the same.

Moreover, the bottom portion 169 c of the through silicon via 169 issurrounded by a lower portion 111L of the silicon layer 111. In someembodiments, the bottom portion 169 c of the through silicon via 169 hasrounded and convex top corners C. In some embodiments, the bottomportion 169 c of the through silicon via 169 is partially covered by thesilicon layer 111. In addition, the through silicon via 169 has a topsurface 169T (i.e., the interface between the through silicon via 169and the conductive pad 175 d in the second semiconductor die 180) and abottom surface 169B (i.e., the interface between the through silicon via169 and the conductive pad 105 c in the first semiconductor die 110). Insome embodiments, the bottom surface 169B is greater than the topsurface 169T, and the top surface 169T is greater than a cross-sectionof the through silicon via 169 between and parallel to the top surface169T and the bottom surface 169B, such as the cross-section CS of thebottle-neck shaped portion 169 b. That is, the bottom width W3 of thethrough silicon via 169 is greater than the top width W4 of the throughsilicon via 169, in accordance with some embodiments.

FIG. 3 is a cross-sectional view illustrating a modified semiconductordevice structure 200, which is an alternative embodiment of thesemiconductor device structure 100, in accordance with some embodiments.For reasons of consistency and clarity, similar components appearing inboth FIGS. 1 and 3 will be labeled the same.

Similar the semiconductor device structure 100, the semiconductor devicestructure 200 includes a through silicon via 269 disposed in a keep-outzone. The through silicon via 269 includes a conductive layer 267′, abarrier layer 265′ surrounding the conductive layer 267′, and a lininglayer 263′ surrounding the barrier layer 165′. A difference between thesemiconductor device structures 100 and 200 is that the semiconductordevice structure 200 further includes a protective layer 161′. As shownin FIG. 3, the sidewalls SW2 of the second mask layer 115, the sidewallsSW1 of the first mask layer 113 and the upper sidewalls USW of thesilicon layer 111 are covered by the protective layer 161′, inaccordance with some embodiments.

FIG. 4 is a partial enlarged view of FIG. 3, in accordance with someembodiments. FIG. 4 illustrates the through silicon via 269, theprotective layer 161′ and their surroundings. In some embodiments, thethrough silicon via 269 includes a top portion 269 a, a bottom portion269 c, and a bottle-neck shaped portion 269 b sandwiched between the topportion 269 a and the bottom portion 269 c. The boundary of the topportion 269 a and the bottle-neck shaped portion 269 b is indicated bythe dotted line I-I′, and the boundary of the bottle-neck shaped portion269 b and the bottom portion 269 c is indicated by the dotted lineII-II′.

In some embodiments, the top portion 269 a of the through silicon via269 is surrounded by the second mask layer 115, and the top portion 269a of the through silicon via 269 has a tapered profile tapering towardthe bottle-neck shaped portion 269 b of the through silicon via 269. Inother words, the widths of the top portion 269 a of the through siliconvia 269 gradually increase along a direction from bottom to top. In someembodiments, the bottle-neck shaped portion 269 b of the through siliconvia 269 is surrounded by the first mask layer 113 and an upper portion111U of the silicon layer 111, and the widths of the bottle-neck shapedportion 269 b of the through silicon via 269 are substantially the same.

Moreover, the bottom portion 269 c of the through silicon via 269 issurrounded by a lower portion 111L of the silicon layer 111. In someembodiments, the bottom portion 269 c of the through silicon via 269 hasrounded and convex top corners C. In some embodiments, the bottomportion 269 c of the through silicon via 269 is partially covered by thesilicon layer 111. In addition, the through silicon via 269 has a topsurface 269T (i.e., the interface between the through silicon via 269and the conductive pad 175 d in the second semiconductor die 180) and abottom surface 269B (i.e., the interface between the through silicon via269 and the conductive pad 105 c in the first semiconductor die 110). Insome embodiments, the bottom surface 269B is greater than the topsurface 269T, and the top surface 269T is greater than a cross-sectionof the through silicon via 269 between and parallel to the top surface269T and the bottom surface 269B, such as the cross-section CS of thebottle-neck shaped portion 269 b. In some embodiments, the throughsilicon via 269 has a bottom width W5 (i.e., the bottommost width of thebottom portion 269 c) and a top width W6 (i.e., the topmost width of thetop portion 269 a), and the bottom width W5 is greater than the topwidth W6. Referring to FIGS. 3 and 4, the bottom portion 269 c of thethrough silicon via 269 contacts the conductive pad 105 c having thegreater width W1, and the top portion 269 a of the through silicon via269 contacts the conductive pad 175 d having the smaller width W2.Therefore, the through silicon via 269 can be used to electricallyconnect the first semiconductor die 110 and the second semiconductor die180, which have different design rules.

It should be noted that the first mask layer 113, the second mask layer115 and the upper portion 111U of the silicon layer 111 are separatedfrom the through silicon via 269 by the protective layer 161′, inaccordance with some embodiments. In some embodiments, the top portion269 a and the bottle-neck shaped portion 269 b of the through siliconvia 269 are surrounded by the protective layer 161′. In someembodiments, the bottom portion 269 c of the through silicon via 269 isin direct contact with the lower portion 111L of the silicon layer 111.

FIG. 5 is a flow diagram illustrating a method 10 for forming asemiconductor device structure (including the semiconductor devicestructure 100 and the modified semiconductor device structure 200), andthe method 10 includes steps S11, S13, S15, S17, S19, S21, S23, S25, S27and S29, in accordance with some embodiments. The steps S11 to S29 ofFIG. 5 are elaborated in connection with the following figures.

FIGS. 6 to 18 are cross-sectional views illustrating intermediate stagesof forming the semiconductor device structure 100, in accordance withsome embodiments. As shown in FIG. 6, the first semiconductor die 110including the semiconductor substrate 101, the dielectric layer 103 andthe conductive pads 105 a, 105 b and 105 c is provided, and the siliconlayer 111 is formed over the first semiconductor die 110, in accordancewith some embodiments. The respective step is illustrated as the stepS11 in the method 10 shown in FIG. 5.

The first semiconductor die 110 may be a portion of an integratedcircuit (IC) chip that includes various passive and activemicroelectronic devices, such as resistors, capacitors, inductors,diodes, p-type field effect transistors (pFETs), n-type field effecttransistors (nFETs), metal-oxide semiconductor field effect transistors(MOSFETs), complementary metal-oxide semiconductor (CMOS) transistors,bipolar junction transistors (BJTs), laterally diffused MOS (LDMOS)transistors, high voltage transistors, high frequency transistors, finfield-effect transistors (FinFETs), other suitable IC components, orcombinations thereof.

Depending on the IC fabrication stage, the first semiconductor die 110may include various material layers (e.g., dielectric layers,semiconductor layers, and/or conductive layers) configured to form ICfeatures (e.g., doped regions, isolation features, gate features,source/drain features, interconnect features, other features, orcombinations thereof). The first semiconductor die 110 has beensimplified for the sake of clarity. It should be noted that additionalfeatures can be added in the first semiconductor die 110, and some ofthe features described below can be replaced, modified, or eliminated inother embodiments. In some embodiments, the silicon layer 111 isepitaxially grown on the first semiconductor die 110.

Next, the first mask layer 113 is formed over the silicon layer 111, andthe second mask layer 115 is formed over the first mask layer 113, asshown in FIG. 7 in accordance with some embodiments. The respective stepis illustrated as the step S13 in the method 10 shown in FIG. 5. In someembodiments, the first mask layer 113 and the second mask layer 115 aremade of dielectric materials, such as silicon oxide, silicon nitride,silicon oxynitride, and are formed by deposition processes, such aschemical vapor deposition (CVD) processes, physical vapor deposition(PVD) processes, spin-on coating processes. Moreover, a patterned mask117 is formed over the second mask layer 115, in accordance with someembodiments. In some embodiments, the patterned mask 117 has an opening120 exposing a portion of the second mask layer 115.

Subsequently, the second mask layer 115 is etched by using the patternedmask 117 as a mask, such that an opening 130 is formed penetratingthrough the second mask layer 115, as shown in FIG. 8 in accordance withsome embodiments. The respective step is illustrated as the step S15 inthe method 10 shown in FIG. 5. In some embodiments, a portion of thefirst mask layer 113 is exposed by the opening 130 in the second masklayer 115. The etching process may be a dry etching process, a wetetching process, or a combination thereof. After the etching process,the patterned mask 117 may be removed.

Then, the first mask layer 113 is etched by using the second mask layer115 as a mask, such that an opening 140 is formed penetrating throughthe first mask layer 113, as shown in FIG. 9 in accordance with someembodiments. The respective step is illustrated as the step S17 in themethod 10 shown in FIG. 5. In some embodiments, a portion of the siliconlayer 111 is exposed by the opening 140 in the first mask layer 113. Theetching process may be a dry etching process, a wet etching process, ora combination thereof. In some embodiments, the sidewall of the firstmask layer 113 in of the opening 140 is substantially aligned with thesidewalls of the opening 130 in the second mask layer 115.

After the openings 130 and 140 are formed, the silicon layer 111 isetched by using the first mask layer 113 as a mask, such that an opening150 is formed penetrating through the silicon layer 111, as shown inFIG. 10 in accordance with some embodiments. The respective step isillustrated as the step S19 in the method 10 shown in FIG. 5. Theetching process may be a dry etching process, a wet etching process, ora combination thereof.

In some embodiments, the conductive pad 105 c is exposed by the opening150. In some embodiments, the second mask layer 115 is formed from amaterial that has a high etching selectivity compared to the material ofthe first mask layer 113. As a result, the second mask layer 115 isetched to form an enlarged opening 130′ during the etching process forforming the opening 150 in the silicon layer 111.

In some embodiments, the enlarged opening 130′ has a tapered profiletapering toward the opening 140 in the first mask layer 113. In someembodiments, the second mask layer 115 have inclined sidewalls relativeto the sidewalls of the first mask layer 113, and an angle θ is betweenthe inclined sidewalls and the bottom surface of the second mask layer115. In some embodiments, the angle θ is in a range from about 46degrees to about 60 degrees. The inclined sidewalls of the second masklayer 115 can provide improved step coverage for the subsequently formedprotective layer 161.

Next, the protective layer 161 is deposited over the second mask layer115 and covering the sidewalls of the second mask layer 115, thesidewalls of the first mask layer 113 and the upper sidewalls of thesilicon layer 111 (i.e., the sidewalls of the upper portion 111U of thesilicon layer 111), as shown in FIG. 11 in accordance with someembodiments. The respective step is illustrated as the step S21 in themethod 10 shown in FIG. 5. It should be noted that the lower sidewallsof the silicon layer 111 (i.e., the sidewalls of the lower portion 111Lof the silicon layer 111) are not covered by the protective layer 161.

The dotted line of FIG. 1I is used to illustrate the boundary of theupper portion 111U and the lower portion 111L of the silicon layer 111.In some embodiments, the protective layer 161 is formed by anon-conformal deposition process, such as a non-conformal liner atomiclayer deposition (NOLA) process. In some embodiments, the protectivelayer 161 includes an oxide material, such as aluminum oxide.

Then, the silicon layer 111 is etched by using the protective layer 161as a mask to form an enlarged opening 150′, as shown in FIG. 12 inaccordance with some embodiments. The respective step is illustrated asthe step S23 in the method 10 shown in FIG. 5. In some embodiments, thelower portion 111L of the silicon layer 11I is laterally etched, whilethe upper portion 111U of the silicon layer 111 remains intact for beingshielded by the protective layer 161.

In some embodiments, the upper portion 111U of the silicon layer 111 isundercut by the etching process for forming the enlarged opening 150′.In some embodiments, the enlarged opening 150′ may be formed by anisotropic etching process. The isotropic etching process may be a wetetching process, a dry etching process, or a combination thereof. Insome embodiments, an etching solution including nitric acid (HNO₃) andhydrofluoric acid (HF) is used to form the enlarged opening 150′. Insome embodiments, the etching solution further includes phosphoric acid(H₃PO₄). In other embodiments, fluorine-based plasma is used to form theenlarged opening 150′.

After the enlarged opening 150′ is formed, the protective layer 161 isremoved, as shown in FIG. 13 in accordance with some embodiments. Therespective step is illustrated as the step S25 in the method 10 shown inFIG. 5. The protective layer 161 may be removed by a wet etchingprocess, a dry etching process, or a combination thereof. In someembodiments, an etching solution including phosphoric acid (H₃PO₄) isused to remove the protective layer 161.

Next, a lining material 163 is formed over the second mask layer 115 andcovering the sidewalls of the opening 130′, the sidewalls of the opening140, the sidewalls and the bottom surface of the opening 150′, as shownin FIG. 14 in accordance with some embodiments. In other words, theinclined sidewalls of the second mask layer 15, the sidewalls of thefirst mask layer 113, the sidewalls of the silicon layer 111, and theexposed surface of the conductive pad 105 c are covered by the liningmaterial 163.

The lining material 163 is conformally deposited over the structure ofFIG. 13, and the lining material 163 is used to separate thesubsequently formed conductive layers from the silicon layer 111. Insome embodiments, the lining material 163 is made of silicon oxide,tetraethylorthosilicate (TEOS) oxide, silicon nitride, polyimide,another applicable dielectric material, or a combination thereof.Moreover, the lining material 163 may be formed by a thermal oxidationprocess, a CVD process, a PVD process, or another applicable depositionprocess.

Then, an anisotropic etching process is performed on the lining material163 to remove the same amount of the lining material 163 vertically inall places, leaving the lining layer 163′ on the sidewalls of theopenings 130′, 140 and 150′, as shown in FIG. 15 in accordance with someembodiments. The anisotropic etching process performed on the liningmaterial 163 may be a dry etching process. After the anisotropic etchingprocess is performed, the conductive pad 105 c is exposed by theopenings 150′, 140 and 130′, in accordance with some embodiments.

Subsequently, a barrier material 165 is formed over the second masklayer 115 and the lining layer 163′, as shown in FIG. 16 in accordancewith some embodiments. In some embodiments, the exposed surface of theconductive pad 105 c is covered by the barrier material 165. The barriermaterial 165 functions as a diffusion barrier to prevent metal diffusionand as an adhesion layer between the lining layer 163′ and thesubsequently formed conductive material. In some embodiments, thebarrier material 165 includes TaN, Ta, Ti, TiN, TiSiN, WN, CoW, or acombination thereof. The barrier material 165 may be formed by a CVDprocess, a PVD process, a sputtering process, or another applicableprocess.

Then, a conductive material 167 is formed over the barrier material 165,as shown in FIG. 17 in accordance with some embodiments. In someembodiments, the remaining portions of the openings 130′, 140 and 150′are filled by the conductive material 167. Before the conductivematerial 167 is formed, a seed layer (not shown) may be formed over thebarrier material 165.

The seed layer may be a copper seed layer and may be formed by a CVDprocess, a PVD process, a sputtering process, a plating process, oranother applicable process. In some embodiments, the conductive material167 includes a low resistivity conductive material, such as copper (Cu).In some other embodiments, the conductive material 167 includes tungsten(W), aluminum (Al), titanium (Ti), tantalum (Ta), gold (Au), silver(Ag), a combination thereof, or another applicable conductive material.The conductive material 167 may be formed by a CVD process, a PVDprocess, a sputtering process, a plating process, or another applicableprocess.

After the conductive material 167 is formed, a planarization process isperformed on the conductive material 167 and the barrier material 165 toform the through silicon via 169, and the through silicon via 169includes the lining layer 163′, the barrier layer 165′ and theconductive layer 167′, as shown in FIG. 18 in accordance with someembodiments. The planarization process may include a chemical mechanicalpolishing (CMP) process, which removes the excess portions of theconductive material 167 and the barrier material 165 over the secondmask layer 115. The respective step is illustrated as the step S27 inthe method 10 shown in FIG. 5.

Next, the second semiconductor die 180 is formed over the second masklayer 115, as shown in FIG. 1 in accordance with some embodiments. Therespective step is illustrated as the step S29 in the method 10 shown inFIG. 5. In some embodiments, the second semiconductor die 180 is bondedto the structure of FIG. 17 such that the conductive pads 175 a, 175 b,175 c, 175 d and 175 e face the through silicon via 169. After thesecond semiconductor die 180 is formed, the semiconductor devicestructure 100 is obtained.

Similar to the first semiconductor die 110, the second semiconductor die180 may be a portion of an IC chip that includes various passive andactive microelectronic devices, and the second semiconductor die 180 mayinclude various material layers configured to form IC features. In someembodiments, the through silicon via 169 electrically connects theconductive pad 105 c of the first semiconductor die 110 and theconductive pad 175 d of the second semiconductor die 180. Since thesecond semiconductor die 180 is formed after the through silicon via169, the risk of damaging the conductive pads 175 a, 175 b, 175 c, 175 dand 175 e in the second semiconductor die 180 during the processes forforming the through silicon via 169 may be reduced.

FIGS. 19 to 23 are cross-sectional views illustrating intermediatestages of forming the semiconductor device structure 200, in accordancewith some embodiments. After the silicon layer 111 is etched by usingthe protective layer 161 as a mask (i.e., following the step of FIG.12), a lining material 263 is formed over the protective layer 161, asshown in FIG. 19 in accordance with some embodiments. Some materials andprocesses used to form the lining material 263 are similar to, or thesame as those used to form the lining material 163 of FIG. 14, anddetails thereof are not repeated herein.

Next, an anisotropic etching process is performed on the lining material263 to remove the same amount of the lining material 263 vertically inall places, leaving the lining layer 263′ on the sidewalls of theopenings 130′, 140 and 150′, as shown in FIG. 20 in accordance with someembodiments. The anisotropic etching process performed on the liningmaterial 263 may be a dry etching process. After the anisotropic etchingprocess is performed, the conductive pad 105 c is exposed by theopenings 150′, 140 and 130′, in accordance with some embodiments.

Subsequently, a barrier material 265 is formed over the protective layer161 and the lining layer 263′, as shown in FIG. 21 in accordance withsome embodiments. Some materials and processes used to form the barriermaterial 265 are similar to, or the same as those used to form thebarrier material 165 of FIG. 16, and details thereof are not repeatedherein.

Then, a conductive material 267 is formed over the barrier material 265,as shown in FIG. 22 in accordance with some embodiments. In someembodiments, the remaining portions of the openings 130′, 140 and 150′are filled by the conductive material 267. Before the conductivematerial 267 is formed, a seed layer (not shown) may be formed over thebarrier material 265. Some materials and processes used to form theconductive material 267 are similar to, or the same as those used toform the conductive material 167 of FIG. 17, and details thereof are notrepeated herein.

After the conductive material 267 is formed, a planarization process isperformed on the conductive material 267, the barrier material 265 andthe protective layer 161 to form the through silicon via 269 and aremaining portion of the protective layer 161′, as shown in FIG. 23 inaccordance with some embodiments. The through silicon via 269 includesthe lining layer 263′, the barrier layer 265′ and the conductive layer267′. The planarization process may include a CMP process, which removesthe excess portions of the conductive material 267, the barrier material265 and the protective layer 161 over the second mask layer 115.

Next, the second semiconductor die 180 is formed over the second masklayer 115, as shown in FIG. 3 in accordance with some embodiments. Insome embodiments, the second semiconductor die 180 is bonded to thestructure of FIG. 23 such that the conductive pads 175 a, 175 b, 175 c,175 d and 175 e face the through silicon via 269. In some embodiments,the protective layer 161′ is in direct contact with the secondsemiconductor die 180. After the second semiconductor die 180 is formed,the semiconductor device structure 200 is obtained.

In some embodiments, the through silicon via 269 electrically connectsthe conductive pad 105 c of the first semiconductor die 110 and theconductive pad 175 d of the second semiconductor die 180. Since thesecond semiconductor die 180 is formed after the through silicon via269, the risk of damaging the conductive pads 175 a, 175 b, 175 c, 175 dand 175 e in the second semiconductor die 180 during the processes forforming the through silicon via 269 may be reduced.

Embodiments of the semiconductor device structures 100 and 200 areprovided in the disclosure. In some embodiments, the through siliconvias 169 and 269 penetrating through the silicon layer 111, the firstmask layer 113 and the second mask layer 115 are formed to electricallyconnect the first semiconductor die 110 and the second semiconductor die180 in vertical direction. The through silicon vias 169 and 269 havebottle-shaped profiles. For example, the bottom surface 169B of thethrough silicon via 169 is greater than the top surface 169T of thethrough silicon via 169, and the top surface 169T of the through siliconvia 169 is greater than a cross-section (e.g., the cross-section CS) ofthe through silicon via 169 between and parallel to the top surface 169Tand the bottom surface 169B of the through silicon via 169. Therefore,the through silicon vias 169 and 269 can be used to electrically connectthe first semiconductor die 110 and the second semiconductor die 180,which have different design rules (e.g., different pattern densities ordifferent critical dimensions). As a result, functional density (i.e.,the number of interconnected devices per chip area) may be increased,providing benefits such as increased production efficiency, loweredcosts, and improved performance.

In one embodiment of the present disclosure, a semiconductor device isprovided. The semiconductor device structure includes a silicon layerdisposed over a first semiconductor die, and a first mask layer disposedover the silicon layer. The semiconductor device structure also includesa second semiconductor die disposed over the first mask layer, and athrough silicon via penetrating through the silicon layer and the firstmask layer. A bottom surface of the through silicon via is greater thana top surface of the through silicon via, and the top surface of thethrough silicon via is greater than a cross-section of the throughsilicon via between and parallel to the top surface and the bottomsurface of the through silicon via.

In another embodiment of the present disclosure, a semiconductor deviceis provided. The semiconductor device structure includes a silicon layerdisposed over a first semiconductor die, and a first mask layer disposedover the silicon layer. The semiconductor device structure also includesa second mask layer disposed over the first mask layer, and a secondsemiconductor die disposed over the second mask layer. The semiconductordevice structure further includes a through silicon via penetratingthrough the silicon layer, the first mask layer and the second masklayer to electrically connect the first semiconductor die and the secondsemiconductor die. The through silicon via has a bottle-neck shapedportion surrounded by the first mask layer and an upper portion of thesilicon layer, and an interface area between the through silicon via andthe first semiconductor die is greater than an interface area betweenthe through silicon via and the second semiconductor die.

In yet another embodiment of the present disclosure, a method forforming a semiconductor device is provided. The method includes forminga silicon layer over a first semiconductor die, and forming a first masklayer over the silicon layer. The method also includes forming a firstopening penetrating through the first mask layer and forming a secondopening penetrating through the silicon layer, and depositing aprotective layer over the first mask layer. The protective layer extendsto cover a sidewall of the first mask layer and an upper sidewall of thesilicon layer. The method further includes etching the silicon layer byusing the protective layer as a mask to undercut an upper portion of thesilicon layer such that an enlarged second opening is formed. Inaddition, the method includes filling the first opening and the enlargedsecond opening with a through silicon via, and forming a secondsemiconductor die over the through silicon via.

The embodiments of the present disclosure have some advantageousfeatures. By forming a through silicon via having a bottle-shapedprofile, the through silicon via can be used to electrically connect twosemiconductor dies (or semiconductor wafers) with different design rulesin the vertical direction. As a result, production efficiency may beincreased, costs may be lowered, and performance may be improved.

Although the present disclosure and its advantages have been describedin detail, it should be understood that various changes, substitutionsand alterations can be made herein without departing from the spirit andscope of the disclosure as defined by the appended claims. For example,many of the processes discussed above can be implemented in differentmethodologies and replaced by other processes, or a combination thereof.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present disclosure. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, and steps.

What is claimed is:
 1. A semiconductor device structure, comprising: asilicon layer disposed over a first semiconductor die; a first masklayer disposed over the silicon layer; and a second semiconductor diedisposed over the first mask layer; and a through silicon viapenetrating through the silicon layer and the first mask layer, whereina bottom surface of the through silicon via is greater than a topsurface of the through silicon via, and the top surface of the throughsilicon via is greater than a cross-section of the through silicon viabetween and parallel to the top surface and the bottom surface of thethrough silicon via.
 2. The semiconductor device structure of claim 1,wherein the through silicon via is in direct contact with a firstconductive pad in the first semiconductor die and a second conductivepad in the second semiconductor die.
 3. The semiconductor devicestructure of claim 2, further comprising: a third conductive paddisposed in the first semiconductor die and adjacent to the firstconductive pad; and a fourth conductive pad disposed in the secondsemiconductor die and adjacent to the second conductive pad, wherein alateral distance between the third conductive pad and the firstconductive pad in the first semiconductor die is greater than a lateraldistance between the fourth conductive pad and the second conductive padin the second semiconductor die.
 4. The semiconductor device structureof claim 1, further comprising: a second mask layer disposed between thefirst mask layer and the second semiconductor die, wherein the throughsilicon via penetrates through the second mask layer, and wherein thefirst mask layer and the second mask layer are made of differentmaterials.
 5. The semiconductor device structure of claim 4, wherein asidewall of the second mask layer is inclined relative to a sidewall ofthe first mask layer.
 6. The semiconductor device structure of claim 5,further comprising: a protective layer covering the sidewall of thesecond mask layer, the sidewall of the first mask layer and an uppersidewall of the silicon layer, wherein the upper sidewall of the siliconlayer is substantially aligned with the sidewall of the first masklayer.
 7. The semiconductor device structure of claim 1, wherein thethrough silicon via comprises: a conductive layer; a barrier layercovering sidewalls and a bottom surface of the conductive layer, whereinthe barrier layer is in direct contact with the first semiconductor die;and a lining layer covering sidewalls of the barrier layer.
 8. Asemiconductor device structure, comprising: a silicon layer disposedover a first semiconductor die; a first mask layer disposed over thesilicon layer; a second mask layer disposed over the first mask layer; asecond semiconductor die disposed over the second mask layer; and athrough silicon via penetrating through the silicon layer, the firstmask layer and the second mask layer to electrically connect the firstsemiconductor die and the second semiconductor die, wherein the throughsilicon via has a bottle-neck shaped portion surrounded by the firstmask layer and an upper portion of the silicon layer, and an interfacearea between the through silicon via and the first semiconductor die isgreater than an interface area between the through silicon via and thesecond semiconductor die.
 9. The semiconductor device structure of claim8, wherein the first semiconductor die has a first critical dimension,and the second semiconductor die has a second critical dimension, andthe first critical dimension is greater than the second criticaldimension.
 10. The semiconductor device structure of claim 8, whereinthe through silicon via further comprises: a top portion surrounded bythe second mask layer; and a bottom portion surrounded by a lowerportion of the silicon layer, wherein the bottle-neck shaped portion ofthe through silicon via is sandwiched between the top portion and thebottom portion of the through silicon via, and the top portion of thethrough silicon via has a tapered profile tapering toward thebottle-neck shaped portion of the through silicon via.
 11. Thesemiconductor device of claim 10, wherein the bottom portion of thethrough silicon via has rounded and convex top corners.
 12. Thesemiconductor device structure of claim 10, wherein the bottle-neckshaped portion and the top portion of the through silicon via areseparated from the first mask layer, the second mask layer and the upperportion of the silicon layer by a protective layer.
 13. Thesemiconductor device structure of claim 12, wherein the bottom portionof the through silicon via is in direct contact with the lower portionof the silicon layer.
 14. The semiconductor device structure of claim12, wherein the protective layer comprises aluminum oxide.
 15. A methodfor forming a semiconductor device structure, comprising: forming asilicon layer over a first semiconductor die; forming a first mask layerover the silicon layer; forming a first opening penetrating through thefirst mask layer and forming a second opening penetrating through thesilicon layer; depositing a protective layer over the first mask layer,wherein the protective layer extends to cover a sidewall of the firstmask layer and an upper sidewall of the silicon layer; etching thesilicon layer by using the protective layer as a mask to undercut anupper portion of the silicon layer such that an enlarged second openingis formed; filling the first opening and the enlarged second openingwith a through silicon via; and forming a second semiconductor die overthe through silicon via.
 16. The method for forming a semiconductordevice structure of claim 15, further comprising: forming a second masklayer over the first mask layer; and forming a third opening penetratingthrough the second mask layer before the first opening penetratingthrough the first mask layer is formed.
 17. The method for forming asemiconductor device structure of claim 16, wherein the second masklayer is etched to form an enlarged third opening during the forming thesecond opening penetrating through the silicon layer, and the enlargedthird opening has a tapered profile tapering toward the first opening.18. The method for forming a semiconductor device structure of claim 15,wherein the protective layer is formed by a non-conformal depositionprocess.
 19. The semiconductor device structure of claim 15, furthercomprising: removing the protective layer before the through silicon viais formed.
 20. The semiconductor device structure of claim 15, whereinthe upper portion of the silicon layer covers a bottom portion of thethrough silicon via.